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The 10-year main contract of treasury bond futures rose in the afternoon, hitting a record high. The 10-year main contract of treasury bond futures rose in the afternoon and now rose by 0.17% to 108.335 yuan, hitting a record high. In addition, the 30-year main contract rose by 0.27%, the 5-year main contract rose by 0.07%, and the 2-year main contract rose by 0.03%.The weighted share price index of Taiwan Stock Exchange closed 0.6% higher at 23,046.80 points.Indian Trade Secretary: India's export performance is very good. India's service trade will soon reach 50% of the total trade volume.

The deposit interest rate is declining, and the interbank deposit receipt fund is popular. Under the background of the current downward trend of non-bank interbank deposit interest rate, the interbank deposit receipt rate is relatively more attractive, and the interbank deposit receipt fund has recently gained the popularity of funds. On December 12, Hongta laterite fund announced that the company held a meeting of fund share holders of the 7-day holding fund of Hongta laterite CSI interbank deposit certificate AAA index by means of communication to review the proposal on matters related to the continuous operation of the fund. Previously, the fund had a net asset value of less than 50 million yuan for 60 consecutive working days. However, the fund shares voted at the fund share holders' meeting were less than half of the total fund shares on the equity registration date, and failed to meet the effective meeting conditions. On December 5th, the 7-day holding period of the AAA index of China National Securities Interbank Deposit Certificate also announced the convening of the holders' meeting on the continuous operation of the fund, and the fund manager proposed to continue to operate the fund. (CSI Taurus)A former employee of Adebio was sentenced and involved in AstraZeneca employees' insurance fraud case. A former employee of the genetic testing company Aidebio, which worked closely with AstraZeneca, committed medical insurance fraud together with AstraZeneca sales staff during his tenure in the company. He was sentenced to three years' imprisonment and fined for fraud, and I pleaded guilty. A judgment obtained shows that Ma, a former employee of Aide Bio involved in the case, conspired with AstraZeneca employees to tamper with the genetic test report during his tenure. He began to accept public security investigation in September 2021 and was sentenced in August 2023. However, on December 9, 2024, the company replied that "there is no problem (cooperation with AstraZeneca), which has no impact on us and has nothing to do with us" and denied that any employees were involved. (financial magazine)New Zealand plans to modify the "golden visa" to attract wealthy immigrants, and the New Zealand government is planning to modify its so-called "golden visa" program to attract more wealthy immigrants to invest in New Zealand. The active investor PLUS visa has always attracted the rich to New Zealand, bringing an average of NZ $1 billion (US$ 580 million) to New Zealand every year, but it has been sluggish since the rules changed in 2022. According to the data of Immigration New Zealand, in the past two years, only 35 applications were fully approved, equivalent to NZ $352 million in investment funds. In an interview in Wellington on Thursday, Finance Minister Nicola Willis said, "We realized that the previous government changed these settings, and we saw a significant drop in the number of investors. You can expect to see our announcement in this regard in the next few weeks. "

This year, the amount of M&A transactions involving listed companies in Hong Kong has reached 38 billion US dollars, which has triggered a rare bidding war. This year is expected to be the busiest year for M&A transactions involving listed companies in Hong Kong in the past decade, with industries ranging from skin care products to logistics real estate, and the bidding war has also warmed up. It is reported that China Mobile's bid for Hongkong Broadband may face competition from American private equity firm I Squared Capital. Bi Hua, chairman of Fenmei Packaging, is negotiating with Qihao Capital to jointly counter the privatization offer of Shandong Xinjufeng. The data shows that the scale of M&A transactions for listed companies in Hong Kong has reached $38 billion this year, the highest level since 2017, including the merger of Guotai Junan Securities and Haitong Securities, a smaller competitor, to become the largest brokerage firm in China.According to the Quarterly Report of the Securities and Futures Commission, Hong Kong's capital market has benefited from the success of the interconnection mechanism with the mainland stock market since the third quarter, as well as the breakthrough in contact with the Middle East market. The net capital inflow of Hong Kong Stock Connect is strong. After the optimization of ETF Connect, the number of eligible Hong Kong ETFs has increased to 16, with a total market value of over HK$ 300 billion. Cross-border wealth management investment in the south has increased by over 60% since optimization, and the net subscription of Hong Kong funds has reached RMB 8.8 billion. The CSRC is considering the license applications of 15 virtual asset trading platforms, and it is expected that several operators will be licensed during the year. Liang Fengyi, Chief Executive Officer of China Securities Regulatory Commission, said that the ETF market in Hong Kong has achieved several new milestones this year and will devote itself to building a global hub. (Hong Kong Securities Regulatory Commission)Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)